- AMD Radeon AI PRO R9700S delivers 47.8 teraflops of peak FP32 processing power
- AMD equips R9700S with 32GB of GDDR6 memory for artificial intelligence tasks
- PCIe 5.0 x16 support provides high-speed connectivity for artificial intelligence applications.
AMD introduced the Radeon AI PRO R9700S, a passively cooled workstation GPU that joins P9000 series and promises enterprise-grade AI performance.
Since launching this series earlier this year, Several major brands have confirmed products with R9700 cardswhich indicates active adoption in the industry.
The R9700S retains the same Navi 48 RDNA4 configuration as the standard R9700, offering 64 compute units and 4096 stream processors.
Passive cooling for high-density AI workloads
Its boost clock speed reaches 2920 MHz and delivers 47.8 teraflops of peak FP32 throughput, making it a suitable option for enterprise AI workloads.
Designed for high-density racks and multi-GPU setups, the R9700S uses 32GB of GDDR6 memory buffers on a 256-bit bus with 64MB of Infinity Cache.
PCIe 5.0 x16 support provides high-speed connectivity with compatible workstation platforms.
The “S” designation on the R9700S indicates a silent design that replaces the fan cooler of previous models.
This approach uses system airflow rather than built-in fans, making the GPU suitable for compact racks where multiple cards work closely together.
Despite being passively cooled, the card maintains a TDP of 300W and is powered through a single 12V-2×6 connector.
This approach reflects AMD's commitment to maintaining compute performance without adding active components.
The company also launched the R9600D, which scales up to 48 compute units and 3072 stream processors while maintaining identical memory.
However, the R9700S provides higher throughput for larger AI models.
Both cards support Linux ECC memory options and are fully compatible with AMD Software PRO Edition and ROCm integration.
The R9700S is optimized for tasks such as generative AI inference and training large language models.
This allows enterprises to move resource-intensive workloads from CPU cores to GPU accelerators.
Early adoption of the R9700 appeared in off-the-shelf systems such as Workstation Elsa Veluga-D A70S G6.
It pairs the GPU with an AMD Ryzen 7 9700X processor, 64GB of DDR5 RAM, and PCIe expansion slots for additional accelerators.
With these chips, AMD delivers turnkey AI computing solutions with a focus on memory bandwidth, power, and quiet operation.
However, the high performance of this chip raises questions regarding thermal stability in dense environments.
Therefore, enterprises deploying multiple devices must consider system-level airflow and heat management to maintain stability during peak AI workloads.
By using Video card
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