- The 2mm thick SSD delivers 6500MB/s write speeds despite its size.
- Longsys eliminates nearly 1,000 solder joints with wafer-level integration technology
- MicroSSD reduces defects from 1000 DPPM to just 100.
Longsys has introduced what it calls the industry's first microSSD with an integrated chassis, or mSSD, using a design that combines several key components into a single compact package.
The mSSD measures just 20 x 30mm, is just 2mm thick and weighs just 2.2 grams.
Despite its size, it supports PCIe Gen4x4 performance, achieving sequential read speeds of up to 7400 MB/s and write speeds of up to 6500 MB/s.
Integrated Chip Packaging
This device delivers random read and write speeds of up to 1,000,000 and 820,000 IOPS, respectively, while maintaining performance on par with larger M.2 drives.
Unlike traditional solid state drives which are based on PCB assembly, mSSD uses System-in-Package (SiP) technology at the wafer level.
This approach combines the controller, NAND flash, power management IC, and other passive components into a single package.
This eliminates nearly 1,000 solder joints typically found in PCB-based SSDs.
Longsis As stated (originally in Chinese), this change improves overall reliability by reducing the number of defects from less than or equal to 1000 defective parts per million to less than or equal to 100.
This step also eliminates several manufacturing steps such as PCB placement and reflow soldering, reducing complexity and the risk of solder mask contamination or thermal damage.
With this system, Longsys says it can now complete production from wafer to finished product in a single process.
The company says this doubles delivery efficiency while reducing incremental manufacturing costs by more than 10%.
The design is also said to reduce power consumption by eliminating the high-energy surface-mount process, which can help control carbon emissions and meet environmental regulations.
To ensure thermal performance, Longsys uses a combination of aluminum alloy brackets, graphene inserts, and thermally conductive silicone to dissipate heat.
It meets NVMe power consumption standards, with standby power below 3.5 milliwatts and peak usage within specifications.
Longsys MSSD supports both TLC and QLC NAND in capacities ranging from 512GB to 4TB.
It also includes a modular attachable heatsink that allows the form factor to be expanded to M.2 2230, 2242, or 2280 standards without tools.
This makes it adaptable to a wide range of devices such as business laptopshandheld consoles, drones and virtual reality headsets.
Currently, mSSD is at the stage of increasing mass production, and patents have been registered for it both domestically and abroad.
While its small size and integrated design may appeal to manufacturers, its advanced packaging process may make it more expensive than traditional packaging. portable solid state drives at startup.
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